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Senior DSP Application Engineer

microTECH Global LtdGermany

Vor 30+ Tagen

Stellenbeschreibung

My client is a global leader in developing high-speed System-on-Chip devices for optical products in industrial, communications, electronics, and instrumentation markets with more than 25, employees worldwide.

They're looking for an experienced DSP Engineer to join their team in Braunschweig on a full time, remote basis.

The Role :

Support customers and the field team during product design, certification, and system debugging regarding

application specific DSP SoC chips

Replicate issues of failing devices on internal platform or high-speed transceiver modules

Take full ownership, gather, and analyze data, execute functional tests, and drive electrical and functional IC

issues to solution.

Present data and work with IP and chip design teams solving in-depth IC issues

Review and analyze product schematics, layout and components surrounded by the DSP SoC

Develop test scripts to support issue replication along with high-end RF lab equipment in our local lab

Execute on protocol and electrical validation across PVT on our high-speed devices

Collaborate with IP architects, digital and analog design teams

Documentation of issue investigation, results and procedures applied

Build and support product demos for customers and tradeshows

RMA management and report creation

The Requirements :

Master’s degree (Dipl.-Ing.) or PhD in electrical engineering or computer science or a related subject

Minimum 5 years of experience in application engineering ideally on electro-optical IC products

Excellent working experience of bring-up and measurement of complex IC designs and PCBs

Ability to introduce in complex analog / digital IP blocks

Experience in system level validation with lab and debug equipment used for the measurement of high-speed integrated circuits

Experience with interoperability testing, knowledge of optical fiber communication systems, higher order modulation formats is a plus

Familiar to work with standards, test specifications and equipment vendors

Solid skills developing Python, and debugging embedded C code in a real time SoC environment

MATLAB, and other languages is a plus

Basic understanding of thermo-mechanical IC-package and PCB quality and reliability challenges like warping, delamination, solder-joint cracks etc.

Own assignments with full accountability, remain engaged, ability to work in a multidisciplinary multi-site team, be proactive and positive while solving very challenging problems

Excellent written and verbal communication skills in English and basic German skills

Close collaboration with teams globally distributed; willingness to travel just occasionally

Jobalert für diese Suche erstellen

Application Engineer • Germany

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