Agile scrum master Jobs in Stollberg
Jobalert für diese Suche erstellen
Agile scrum master • stollberg
Master's Thesis - Wafer Bonding and System Packaging
Fraunhofer-GesellschaftChemnitzAusbildungsrelevante Bewerbungen : Diplom-, Master- oder Bachelorarbeit bzw. Praktikum
SyntegonChemnitz, DEScrum Master / Agile Master / Agile Coach (m / w / d)
msgChemnitz- Gesponsert
Fullstack Engineer (m / f / d) - Mid Level - App / Intranet
StaffbaseChemnitz, DE(Senior) Software Engineer (m / f / d)
flexis AGSachsen, DE- Gesponsert
Managing Consultant ServiceNow - ITOM (m / w / d)
operational services GmbH & Co. KGMülsen- Gesponsert
Informatiker als IT Architect SAP S4 HANA Utilities (m|w|d)
envia Mitteldeutsche Energie AG - JobsChemnitz, Sachsen, GermanyScrum Master / Agile Master / Agile Coach (m / w / d)
msg systemsChemnitz, DEScrum Master / Product Owner (m / w / d) bis zu 6.500€
Tech Staff Solutions Heidelberg GmbHChemnitz, Sachsen, DE- Gesponsert
Softwareentwickler KI Anwendungen (m / w / d)
FERCHAU – Connecting People and TechnologiesChemnitz, Sachsen, Germany- Gesponsert
Agile Coach (m / w / d)
KVM ServicePlus Kunden- und Vertriebsmanagement GmbHChemnitz, Sachsen, DESenior Expert Softwareentwicklung (m / w / d) für Web Full-Stack
authentic.network GmbHChemnitz, Saxony, GermanySoftwareentwickler KI Anwendungen (m / w / d)
FERCHAU GmbHChemnitzJava Entwickler (m / w / d) 432001
AKDBChemnitz, DEMasterstudium (Master of Science) Informatik (m / w) in Chemnitz
TU Chemnitz, Fakultät für Informatik von ITsax.deChemnitz, Sachsen, DEProduct Owner (m / w / d)
SchaefflerChemnitzScrum Master (m / w / d)
SD WorxWildenfels, Sachsen, .DEEnglish-language Master programs
TU Chemnitz, Fakultät Elektrotechnik und Informationstechnik von MINTsax.deChemnitz, Sachsen, DE- Gesponsert
IT-Architekt SAP S4 HANA Utilities & Transformation (m|w|d)
envia Mitteldeutsche Energie AGChemnitz, GermanyMaster's Thesis - Wafer Bonding and System Packaging
Fraunhofer-GesellschaftChemnitzFraunhofer ENAS is one of the global leaders in the field of MEMS packaging at the wafer and component level. The wafer-level MEMS package must allow access to desired measurable media (e.g., liquids, gases or light) while simultaneously shielding from unwanted external influences. These bonding technologies are applied not only to passive elements but also to active elements such as micro mirrors and printheads. With regard to advancing system integration, electronic components must also be included in the microsystem.
In the System Packaging department, investigations are carried out that primarily focus on wafer-level integration, in addition to hybrid integration at the chip level. For such vertical stacks, particular attention must be paid to the influences of individual bonding technologies (temperature, pressure), as well as the electrical and thermal behavior of the system. A complete cleanroom preparation line, including characterization equipment for processing 4" to 8" substrates, is available for permanent and temporary wafer-level bonding.
We are looking for motivated Master's students to join our multidisciplinary team and contribute to cutting-edge research in the field of wafer bonding and system packaging .
What you will do
- Together, we will define a topic for your research.
- You will conduct literature research, thereby building a fundamental understanding of processes in microsystem technology.
- The topic may include metallization (with electrochemical deposition), innovative materials, or wafer bonding techniques such as direct, anodic, and hybrid bonding. You will develop an in-depth understanding of the subject matter.
- You will independently carry out your tasks, which includes planning and conducting experiments. Finally, you will summarize your research results in a thesis.
What you bring to the table
What you can expect
We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Interested? Apply online now with your detailed application documents. Please also submit a current transcript of grades with your application.
We look forward to getting to know you!
For data protection reasons, we can only consider applications via our career portal - thank you.
Fraunhofer Institute for Electronic Nano Systems ENAS
Requisition Number : 78048 Application Deadline :