Senior PIC Characterization Engineer TFLN High-Speed (fmd)

Your mission

The future of AI computing builds on light. is building photonic processing systems that compute with light - a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC. Built on a thin-film lithium niobate (TFLN) platform operating in the GHz regime photonic integrated circuits sit at the heart of this technology.

You will drive the photonic and electrical characterization of TFLN PICs in the GHz regime - defining lab setups developing measurement routines and turning fabricated devices into validated production-ready hardware. Beyond characterization you will contribute to the photodiode-PIC integration lifecycle and mentor junior engineers building lab capability.

What You Will Do

Characterization & measurement

• Design and execute high-speed (GHz-regime) characterization routines for TFLN PICs and photodiodes; perform experimental verification and statistical analysis to extract key performance parameters
• Define design build and develop optical and RF test setups - including probe-station configuration calibration routines and continuous optimization
• Develop Python LabVIEW and MATLAB tools for measurement automation data acquisition and analysis

Integration & roadmap

• Contribute to the full photodiode-PIC hybrid integration lifecycle - from concept and design coordination through assembly validation and packaging
• Feed performance insights back to design and manufacturing; propose new components and optimization strategies for the technology and product roadmap

Coordination & leadership

• Schedule and prioritize characterization campaigns in line with project milestones and R&D priorities; coordinate external suppliers service providers and research partners
• Mentor and guide junior engineers and technicians in device testing data acquisition and analysis
• Ensure adherence to lab safety standards and equipment-handling protocols and maintain rigorous documentation of methods code and results

Your profile

Education & experience

• Ph.D. or Masters degree in electrical engineering photonics or a related field
• 5 years of directly relevant experience in industry or research including at least 1 year in GHz-regime high-speed photonic device testing

Technical expertise

• Deep understanding of LNOI (lithium niobate on insulator) device physics and applications including high-speed modulation detection and RF signal integrity; hands-on TFLN experience is a strong plus
• Proven experience in photodiode characterization and hybrid photonic-electronic integration
• Strong hands-on experience with high-speed instrumentation: VNAs high-speed oscilloscopes optical spectrum analyzers RF probes and tunable lasers including calibration methods for optical and RF systems
• Solid programming skills in Python required for measurement automation and data analysis LabVIEW and MATLAB skills are advantageous
• Practical experience in PIC testing optical and RF probe-station measurements optical alignment and optoelectronic system bring-up

Ways of working

• Experience mentoring or supervising junior engineers in lab environments
• Strong communicator who coordinates effectively across cross-functional teams and external partners and influences technical direction without formal authority
• Structured problem-solving mindset with ownership of experimental outcomes
• Fluent English skills are a must; German is beneficial

Why us

• Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes high impact from day one
• Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
• Own your work from day one: Shape characterization strategies integration workflows and roadmap inputs on your own with direct impact on product success
• Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team: Collaborate alongside a passionate international cross-functional team of experts in photonics electronics and packaging
• Direct access to leadership: Work closely with the companys founders including CEO Dr. Michael Förtsch and the senior leadership team
• Collaborative culture: Innovative work environment that values technical excellence open communication and pragmatic problem-solving
• Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation

We are looking for a hands-on engineer who gets energized by turning fabricated PIC components into validated hardware coordinating across teams and partners and directly shaping next-generation photonic technology.

Ready to push the boundaries of what photonic integrated circuits can do We are looking forward to receiving your application!

is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

About us

Who we are and what we do

is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany.

Required Experience:

Senior IC

Employment Type : Full-Time
Experience: years
Vacancy: 1