Power Module Process Expert

About usAbout Li Auto : We're a leading Chinese newenergy vehicle company that designs, develops, manufactures, andsells premium smart electric vehicles (EVs). Through product,technology, and business model innovations, we provide familieswith safer, more comfortable, and more convenient products andservices.About the team：Our power module team is one of the leadingteams in the power semiconductor industry, known for itsexceptional capabilities and expertise in the power semiconductorfield. With a strong focus on innovation and cutting-edge research,we have established ourselves as pioneers in the area of automotivegrade SiC device packaging and application.We welcome candidateswho are passionate about pushing the boundaries of power modulepackaging and are eager to contribute to our team's pioneeringwork. Join our team and be part of an exciting journey where youcan make a significant impact in the field of powersemiconductors.Duties and responsibilitiesTracking SiC power moduletechnology trends, defining power module process technologyroadmap;Leading team to complete pre-research of advanced processtechnologies, organize technical cooperation with universities andresearch institutes;Leading team to develop advanced power moduleprocesses, output process files;Support product development team tofinish product development and import to factory for massproduction;Support mass production process teams to solve majorprocess issues, improve reliability and Website degree or above,major in microelectronics, materials engineering, powerelectronics, mechanical electronics or other related fields;Morethan 8 years of experience in power semiconductor packaging productdevelopment or technology research and development;Experience inindustry-leading product development and mass production ispreferred;Proficient in packaging system design, thermal design,electrical design and reliability design, with industry-leadingprofessional ability in one aspect;Have successful experience inSiC module development, and those who develop products to achievemass production status are preferred;KnowledgeFamiliar with theoverall situation of semiconductor packaging industry, and havegood interpersonal relationships in industry;Profound knowledge ofkey packaging processes & corresponding equipment, e.g. DieAttach, Wire Bonding, Silver / Copper Sintering, Solder Reflow,Molding or Potting, etc.Skills and CompetenciesProactive, withpioneering spirit and a good sense of internal and externalclient;Passionate about engineering, with a strong spirit ofinnovation;Good command of English written and oral communicationskills；Excellent team coordination and communicationskills.ContactHR : PennyEmail : [email protected]