Silicon Photonic Packaging & Process Engineer

About Voyant Photonics

Voyant Photonics, based in the heart of New York City, is transforming machine perception with a new class of LiDAR devices that are compact enough to fit in the palm of your hand and powerful enough to measure range, velocity, and reflectivity with unparalleled accuracy. By leveraging cutting-edge silicon photonic chips smaller than your fingertip, we deliver sensors that are not only revolutionary in performance but also affordable enough to integrate into any system.

Our technology disrupts the status quo of bulky, expensive, and power-hungry LiDAR systems, making high-precision sensing accessible for widespread adoption in robotics, autonomous vehicles, drones, industrial automation, and beyond. With Voyant, the next generation of machines can see, understand, and navigate the world like never before.

Discover how we're redefining what's possible by making real products out of cutting-edge research in silicon photonics.

Position Overview :

As a Silicon Photonic Packaging & Process Engineer, you will lead the development and scaling of precision opto-mechanical assembly processes. You will work closely with photonics, mechanical, and test teams to translate R&D builds into repeatable production processes. You will also partner with our contract manufacturers to qualify lines, improve yields, and drive continuous process improvements.

This is a unique opportunity to take ownership of critical opto-mechanical and electronic assembly processes that define the precision, yield, and quality of Voyant's LiDAR modules. You will establish robust, high-yield manufacturing processes, optimize production at our global contract manufacturers, and help scale complex, high-precision processes from R&D to high-volume production. Your work will directly impact the Carbon and Helium LiDAR modules, accelerating time-to-market, reducing cost, and ensuring consistent product quality across global manufacturing sites.

This position requires willingness to travel up to 50% domestically and internationally, both within the United States and internationally (primarily Europe and Asia), to support process transfer, line qualification, and build execution at our manufacturing partners.

Key Responsibilities

Precision Lens Assembly :

Own process definition and control for automated microlens alignment and bonding. Program motion sequences, optimize camera and vision-based routines, and tune process parameters (alignment offsets, bonding dwell, UV cure profiles, placement forces) to achieve sub-micron accuracy and high yield.

Die Placement Process Ownership :

Define and maintain process parameters for high-precision die-attach and placement equipment. Drive correlation between pick-and-place accuracy, epoxy flow, and bond-line thickness for consistent optical coupling.

Epoxy and Adhesive Dispense Control :

Establish and control parameters for automated dispense systems. Develop dispense recipes controlling needle diameter, pressure, time, temperature, and material conditioning. Characterize cure profiles and shrinkage impacts on optical alignment stability.

Yield and DOE Execution :

Design and execute structured DOEs to characterize process sensitivity and optimize yield. Use statistical methods to quantify variability and identify dominant factors affecting alignment accuracy, void formation, or optical loss.

Measurement and GR&R :

Define measurement methods and run GR&R studies on critical parameters (e.g., placement accuracy, epoxy volume, bond-line thickness). Ensure metrology tools and data systems at the CM are calibrated and controlled.

Factory Execution and Scale-Up :

Lead the implementation of robotics, automation, and material handling solutions by partnering with automation suppliers and contract manufacturers to enable scalable, high-throughput production. Drive failure analysis (FA) and corrective actions (CA) on process-related issues, and continuously improve yield, throughput, and takt time. Partner with the contract manufacturer to qualify processes, train operators, and own line readiness for precision optical assembly builds.

Qualifications :

• BS or MS in Mechanical, Manufacturing, Photonics, or Electrical Engineering (or equivalent experience)
• 5+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments
• Deep familiarity with automated alignment and die-attach systems
• Strong understanding of adhesive dispense physics (viscosity, wetting, cure shrinkage) and related automation equipment
• Proficiency with DOE methods, SPC, and Minitab (or equivalent tools)
• Demonstrated experience working with automation solution providers and contract manufacturers to transfer and adapt prototype processes into high-volume production.
• Excellent problem-solving skills and ability to collaborate across mechanical, optical, and test teams
• Willingness to travel up to 50% domestically and internationally

Preferred Qualifications :

Benefits Package :

Equal Opportunity Employer

Voyant Photonics is an equal opportunity employer committed to building a diverse and inclusive workplace. We welcome applicants from all backgrounds and do not discriminate based on race, color, religion, gender, gender identity or expression, sexual orientation, pregnancy, marital or partnership status, age, national origin, citizenship, veteran or military status, disability, medical condition, genetic information, caregiver status, or any other characteristic protected by law.