Senior Photonics Packaging Engineer (fmd)

• High complexity: Developing novel high-density photonic packaging concepts that simultaneously address thermal management optical alignment RF signal integrity and manufacturability an area with few industry precedents
• Strategic freedom: Broad autonomy to define requirements select suppliers and design technical strategies within strategic goals and budgetary limits
• Decision authority: Direct influence on supplier relationships product architecture decisions and program economics
  innovation mandate: Implementation of at least one new packaging material process or architecture annually that becomes differentiating IP for the company
• Real-world impact: Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing Centre

Within your first 18-24 months you will:

• Achieve leading-edge integration density and performancethrough innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
• Minimize integration risks and reworkthrough rigorous supplier verification and quality assurance
• Contribute to competitive advantageby accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market
  

Key responsibilities:

• Cross-functional leadership: Coordinate internal R&D system engineering manufacturing and test teams to align packaging solutions with overall product architecture
• Supplier engagement & interface role:Act as the primary point of contact for suppliersensuring alignment on technical goals schedules and deliverables including contract management and negotiation
• Project control: Plan and oversee multi-party R&D projects tracking milestones budgets and risks while ensuring deliverables are verified and integrated into final systems
• Technical specification: Define complete packaging requirements including optical coupling techniques thermal management strategies RF signal integrity and hermetic sealing methods
• Quality assurance: Ensure supplier quality ratings maintain 95% on-time delivery with zero critical defects and packaging costs remain within 5% of budgeted targets

• More than 5 years of experienceinhybrid packaging photonics assembly optoelectronic integration or related high-density interconnect technologies
• Proven track recordin managing supplier-led R&D and packaging projects from requirements definition through to integration and validation
• Hands-on experiencewith PICs laser sources photodetectors analog electronics and mixed-signal integration
• Masters or PhDin Photonics Optoelectronics Electrical Engineering Physics or a related field

• Optical coupling techniques(butt-coupling lens coupling fiber array integration)
• Thermal management strategiesfor high-power photonic devices
• Understanding and enhancement of RF signal integrityfor highest performance in different high density interconnects
• Packaging material science(polymers ceramics metals) and hermetic sealing methods
• Relevant standardsfor reliability and environmental testing (e.g. Telcordia JEDEC)

• Familiarity with CAD toolsfor photonics/electronics packaging optical simulation software and statistical process control
  

• Exceptional ability to lead cross-functional teamsacross R&D system engineering manufacturing and test domains
• Skilled in negotiation and contract managementwith external suppliers and R&D partners
• Strong systems thinkingto balance optical electrical thermal and mechanical requirements simultaneously
• Excellent communication skillswith the ability to translate complex technical trade-offs to management and stakeholders

• Fluent in English; German or other European language beneficial

• Experience with photonic integrated circuit (PIC) packagingfor AI or HPC applications
• Knowledge of high-speed digital interfacesand their integration with photonic systems
• Familiarity with scaling systemsfrom prototype to volume production
• Understanding of supply chain management and material supplier ecosystemsin photonics

• Make impact at scale:Help solve one of computings biggest challengesmaking growing demand in compute and sustainability go hand in hand
• Work on the leading edge:Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
• Own your work from day one:Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
• Fast-track your growth:Work on challenges with few industry precedentsevery problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team:Collaborate alongside a passionate international cross-functional team of experts in photonics processor design and AI systems
• Direct access to leadership:Work closely with the companys founders including CEO Dr. Michael Förtsch and advisory board members who shaped the semiconductor industry (ARM Intel Infineon)
• Collaborative culture:Innovative work environment that values technical excellence open communication and pragmatic problem-solving
• Be part of history:Join at the inflection point where photonic computing transitions from research to mainstreamyour contributions will shape this transformation