Senior DSP Application Engineer

My client is a global leader in developing high-speed System-on-Chip devices for optical products in industrial, communications, electronics, and instrumentation markets with more than 25, employees worldwide.

They're looking for an experienced DSP Engineer to join their team in Braunschweig on a full time, remote basis.

The Role :

Support customers and the field team during product design, certification, and system debugging regarding

application specific DSP SoC chips

• Replicate issues of failing devices on internal platform or high-speed transceiver modules
• Take full ownership, gather, and analyze data, execute functional tests, and drive electrical and functional IC

issues to solution.

• Present data and work with IP and chip design teams solving in-depth IC issues
• Review and analyze product schematics, layout and components surrounded by the DSP SoC
• Develop test scripts to support issue replication along with high-end RF lab equipment in our local lab
• Execute on protocol and electrical validation across PVT on our high-speed devices
• Collaborate with IP architects, digital and analog design teams
• Documentation of issue investigation, results and procedures applied
• Build and support product demos for customers and tradeshows
• RMA management and report creation

The Requirements :

• Master’s degree (Dipl.-Ing.) or PhD in electrical engineering or computer science or a related subject
• Minimum 5 years of experience in application engineering ideally on electro-optical IC products
• Excellent working experience of bring-up and measurement of complex IC designs and PCBs
• Ability to introduce in complex analog / digital IP blocks
• Experience in system level validation with lab and debug equipment used for the measurement of high-speed integrated circuits
• Experience with interoperability testing, knowledge of optical fiber communication systems, higher order modulation formats is a plus
• Familiar to work with standards, test specifications and equipment vendors
• Solid skills developing Python, and debugging embedded C code in a real time SoC environment
• MATLAB, and other languages is a plus
• Basic understanding of thermo-mechanical IC-package and PCB quality and reliability challenges like warping, delamination, solder-joint cracks etc.
• Own assignments with full accountability, remain engaged, ability to work in a multidisciplinary multi-site team, be proactive and positive while solving very challenging problems
• Excellent written and verbal communication skills in English and basic German skills
• Close collaboration with teams globally distributed; willingness to travel just occasionally
Vor 30+ Tagen