Order packer Jobs in Dießen am Ammersee

What to expect :

• Drive the optimization of existing SiC power technologies and contribute to develop next generation SiC products, in alignment with company roadmaps
• Use TCAD simulations tools to predict the variation of the device electrical characteristics with the process specs in order to identify potential weaknesses and optimize layout and process, prior to implementation into the manufacturing environment
• Partner with process integration team to ensure the compatibility of the design rules with the manufacturing capabilities
• Design test chip and process / device monitor structures for process control and simulate DOE short loops for process stability improvement and yield enhancement
• Troubleshoot layout design issues and apply proactive intervention, by working closely with design team to ensure proper device performance
• Create device modeling by using TCAD tools and electrical data analysis, while support Process and Design FMEA, Risk Assessment and Control Plan for new products integration
• Contribute to develop new SiC MOSFETs and Diodes concepts and translate them into novel layout and process solutions enabling the development of future generation SiC technologies, in agreement with application specs
• Analyze SiC power technology and trends, anticipating future developments for existing and new applications in the company domains
• Act as an interface for all the process related topics between production, quality department, technology / product development and backend
• Cooperate with internal and external research institutions for new SiC processes introduction and optimization

What you bring along :

What we offer :

Verantwortungsvolle Aufgaben Eigenverantwortliches Arbeiten Konzernweites "Netzwerken" Attraktive Vergütung Teamorientierte Arbeitsweise Verantwortungsvolle Aufgaben Eigenverantwortliches Arbeiten Konzernweites "Netzwerken" Attraktive Vergütung Teamorientierte Arbeitsweise