Senior Photonics Packaging Engineer RF (fmd)

Your mission

The future of AI computing is light not electrons. is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As Senior Photonics Packaging Engineer (f / m / d) you will lead the specification development and verification of high-density photonic packaging solutions that integrate photonic integrated circuits (PICs) light sources photodetectors and analog circuitry into production-ready modules. Youll be the technical authority ensuring that supplier-delivered modules meet stringent optical electrical thermal and mechanical requirements through precise definition of technical requirements contractual agreements and supplier project management.

What makes this role unique :

• High complexity : Developing novel high-density photonic packaging concepts that simultaneously address thermal management optical alignment RF signal integrity and manufacturability an area with few industry precedents
• Strategic freedom : Broad autonomy to define requirements select suppliers and design technical strategies within strategic goals and budgetary limits
• Decision authority : Direct influence on supplier relationships product architecture decisions and program economics

i nnovation mandate : Implementation of at least one new packaging material process or architecture annually that becomes differentiating IP for the company

Within your first 18-24 months you will :

Key responsibilities :

Your profile

Education & Experience :

Deep Technical Expertise in :

Tools & Processes :

Leadership & Coordination Skills :

Languages :

Preferred Qualifications :

Why us

Were looking for a technical leader who gets energized by developing novel photonic packaging solutions managing supplier partnerships and driving innovations that enable production systems to transform AI computing already today.

Ready to shape the future of photonic integration

We are looking forward to receiving your application!

is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

About us

Who we are and what we do

is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany.

Required Experience :

Senior IC

Key Skills

Electrical Engineering,System Design,Computer Networking,LabView,PCB,Triage,5G,Signal Processing,3G,Matlab,Systems Analysis,4G / LTE

Employment Type : Full-Time

Experience : years

Vacancy : 1