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Reliability engineer Jobs in Altlußheim
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Reliability engineer • altlußheim
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Hardware Design Engineer
Universität HeidelbergHeidelberg, Baden-Württemberg, Germany- Gesponsert
System Engineer mfd
turba AIHeidelberg, Baden-Württemberg, GermanyTest as a Service (TaaS) Engineer (m / f / d)
CopelandBaden-Wurttemberg, GermanyIT Network Engineer
ic resourcesBaden-Wurttemberg, Germany- Gesponsert
OT-System Engineer (m / f / d)
Vigier Management AGLyss, Baden-Württemberg, GermanyInstandhaltungstechniker (all genders) , RME - Reliability Maintenance Engineering (m / w / d)
Amazon Erfurt GmbH - O80Heidelberg, DE- Gesponsert
Data Engineer fmd
paretos GmbHHeidelberg, Baden-Württemberg, GermanySenior Innovation Engineer, Amazon (m / w / d)
Amazon Support Services Germany GmbH - I46Heidelberg, DESite Reliability / (Associate) DevOps Engineer (f / m / d) for Gardener (T1 / T2)
SAPWalldorf, DEI&V Engineer
CS GROUPHE, deAutomation Engineer
DSJ GlobalBaden-Württemberg- Gesponsert
Staff Systems Engineer fm
Aleph AlphaHeidelberg, Baden-Württemberg, GermanyPrincipal Software Engineer
Everest Systems GmbHHeidelberg, Baden-Württemberg, GermanyAsstChief Engineer
Heidelberg Marriott HotelVangerowstrasse 16, Heidelberg BW, GermanyDevOps Engineer / SRE
Third RepublicBaden-Württemberg, , Germany- Gesponsert
(Senior) MLOps Engineer (f / m / d)
Cinemo GmbHSpeyer, GermanyAI Engineer (Intern)
EnzoHeidelberg, Baden-Württemberg, GermanyDEVOPS ENGINEER
x-tentionHeidelbergReliability Engineer
ADMHeidelbergIndustrial Engineer
Sunrise MedicalMalsch / HeidelbergHardware Design Engineer
Universität HeidelbergHeidelberg, Baden-Württemberg, GermanyThe Faculty of Engineering Sciences and the Institute of Computer Engineering (ZITI) at Heidelberg University invite applications for a Full Professorship (W3) in "Chip Design- (f / m / d)Heidelberg University is among Germany-s leading universities, with researchers highly experienced in the design, fabrication, testing, and application of electronic microchips. To date, we have realized more than 250 different analogue, digital, and mixed-signal designs with applications spanning computer communication, neuromorphic computing, synchrotron and particle physics, medical physics, embedded FPGA design and more. The university and the institute aim to significantly strengthen and expand the field of chip design in the near future. Our motivation for developing novel chips is very much driven by applications in other research fields, where specialized chips can enable advances in research. We like to move away from established paths, explore new, unconventional ideas based on a solid understanding of established methods and approaches. The successful candidate will strengthen and widen our expertise in the conception, design, and actual implementation of electronic chips. Having practical experience in the process of design, tape-out, and test of a silicon microchip is a requirement for this position. Experience with advanced technology nodes is desirable. The research focus may be on analogue and / or digital design. Heidelberg University offers many opportunities to collaborate with other research groups for chip applications, e.g. in physics, life sciences, materials sciences, medicine, and machine learning.Chip Design is also a focus of the Master-s program in Computer Engineering at the Faculty of Engineering Sciences. The appointee will contribute to this program and to existing or new Bachelor-s programs in the Faculty of Engineering Sciences or the Faculty of Mathematics & Computer Science. For scientific questions about the position, do not hesitate to contact Prof. Dr. Johannes Schemmel ([email protected]).The appointment requires a university degree, an outstanding doctorate, pedagogical aptitude which is usually proven by teaching experience, and, in accordance with article 47 (2) of the Higher Education Law of the state of Baden-Württemberg (LHG), a Habilitation, a successfully evaluated junior professorship or equivalent qualifications, which may also have been obtained in the context of academic work in industry.Applications in English and comprising the usual documents (cover letter, curriculum vitae, list of publications, research and teaching statements), as well as a list of five selected publications with a brief highlight of the applicant-s own contribution to each paper, should be submitted electronically as a single PDF document to Prof. Dr. Guido Kanschat, Dean of the Faculty of Engineering Sciences, at [email protected]. Applications will be given full consideration if received by May 18, 2025.Heidelberg University stands for equal opportunities and diversity. Qualified female candidates are especially invited to apply. Persons with severe disabilities will be given preference if they are equally qualified. Information on job advertisements and the collection of personal data are available at Website